The summary is a very important part of your MCM paper.

是MCM 参赛论文的非常重要组成部分。

MCM is an important method of miniaturizing electronic systems.

多芯片组件（MCM）是实现电子系统小型化的重要手段之一。

MCM technology is used in the design of phase shifter in this paper.

本文采用MCM这一新技术来研制移相器。

The dissertation discussed the whole procedure of developing MCM layout editor.

本文论述了MCM布线编辑器的整个开发过程。

COMAP is pleased to announce a new supplement to the MCM/ICM contest. Click here to read more details.

组委会很高兴宣布一个新的补充赛事（针对MCM/ICM比赛的视频录制比赛）。点击这里阅读详情！

OBJECTIVE: To improve drug burst release and stagnant release of magnetic cisplatin microspheres (MCM).

目的：改善磁性顺铂微球的药物突释和滞释，实现控释。

The hydroisomerization and aromatization of 1-hexene over potassium modified MCM-22 zeolite were investigated.

考察了钾金属修饰的M CM - 22分子筛上1 -己烯加氢异构和芳构化反应。

Y-MCM-41 containing secondary building units of Y zeolite was prepared and then treated by ion exchange method.

制备了含有Y沸石次级结构单元的Y-MCM-41，并对其进行离子交换处理。

In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.

在3d - MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。

There are usually (always) more tollbooths than there are incoming lanes of traffic (see former 2005 MCM Problem b).

而这些收费窗口通常都会比车道条数要多(详情参见2005年M CM的B问题)。

Trypsin was immobilized on the Mesoporous Molecular Sieve MCM-41 with the aid of the coupling agent, glutaraldehyde.

以介孔分子筛m CM - 41作为载体，戊二醛作为交联剂，对胰蛋白酶进行了固定化。

The planar diode is calculated by means of MCM and compared with the analytical solution. The relative error is 0.8%.

用蒙特卡洛法计算了平面二极管并与解析解进行比较，相对误差为0.8％；

For the Four Via routing algorithm used in MCM routing, the maximum weighted non crossing match problem should be solved.

四通孔布线算法用于实际MCM布线时，需要解决最大加权不相交匹配问题。

MCM-22 zeolite was synthesized under stirring by hydrothermal method and used as the catalyst for butene oligomerization.

采用水热法合成了新型多孔材料MCM - 22分子筛，并将其用于丁烯齐聚反应。

Tests results showed that this method could test MCM effectively at a shorter time with a fault coverage of more than 95%.

建立模型进行验证的结果表明：该方法能有效地测试MCM，缩短了测试时间，故障覆盖率达到95%以上。

The structure, failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented.

通过对多芯片组件(MCM)的结构、失效模式和机理的分析，提出了适合我国生产实际的mcm失效率预计模型。

The mesoporous molecular sieves MCM-41 is synthesized with CTAB as template and TEOS as silica source in the basic conditions.

以十六烷基三甲基溴化铵为模板剂，正硅酸乙酯为硅源，在碱性条件下合成了介孔分子筛m CM - 41。

The Mathematical Association of America (MAA) will designate one Outstanding Team from each problem for the MCM as a MAA winner.

美国数学协会（MAA）将从MCM 的每个题目中指定一个杰出队作为一个MAA 赢家。

Bare chips find wide application in the fields of HIC and MCM, whose quality and reliability assurance have been concerned about.

裸芯片在HIC和MCM应用领域有着广泛的市场，其质量和可靠性保证一直受关注。

The characteristic results showed that the MCM-48 material possessed high specific surface areas and well-ordered channel systems.

结果表明，合成的MCM-48材料具有高的比表面积和高度有序的孔道系统。

MCM-48 synthesized at high pressure appeared higher thermal and hydrothermal stability than that synthesized at autogenous pressure.

与常压合成的相比，高压下合成的MCM - 48具有更高的热稳定性和水热稳定性。

This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.

本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。

Thee Society for Industrial and Applied Mathematics (SIAM) will designate one Outstanding Team from each MCM problem as a SIAM winner.

美国工业和应用数学学会(SIAM)将从MCM M的每个题目中指定一个杰出队作为一个SIAM赢家。

A thermal model of the MCM-D package has been obtained, taking into account all the thermal resistances added by this kind of package.

已获得MCM封装的热模型，并考虑由此类封装增加的所有的热电阻。

Objective: Improving drug burst release and stagnant release of magnetic cisplatin microspheres (MCM) and achieving controlled release.

目的：改善磁性顺铂微球的药突释和滞释，实现控释。

This paper Outlines the design of features related to test and then details the Boundary Scan test strategies developed for different MCM.

本文概要论及与测试相关的设计特性，详细讨论了不同MCM的边界扫描测试策略。

This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors, metal lines and vias for interconnection.

本研究重点研究了MCM—C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。